COMPARISON OF PACKAGING TECHNOLOGIES FOR RF MEMS SWITCH
نویسندگان
چکیده
منابع مشابه
Comparison of Packaging Technologies for RF MEMS Switch
Abstract—The present paper describes an integrated approach for design, fabrication and encapsulation of RF MEMS switches in view of the optimal performance subsequent to packaging. ‘Top and bottom contact’ fabrication approaches are explored using different RF MEMS switch topologies. In the ‘bottom contact package (BCP)’ the packaging cap alignment is less critical as compared to the top conta...
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ژورنال
عنوان ژورنال: Progress In Electromagnetics Research M
سال: 2014
ISSN: 1937-8726
DOI: 10.2528/pierm14073002